The "Ultrasonic Polishing and Cutting Device" of Takata Industrial Co., Ltd. will be launched in Japan in June 2007.
The biggest feature of this machine tool is that it can be cut and ground at the same time. The principle is to apply ultrasonic vibration on the high speed rotating diamond blade. Moreover, due to the use of diamond blades, a variety of different materials can be processed, including hard materials such as glass and hard alloy, soft materials such as aluminum alloys and resins, and composite materials of metals, inorganic materials and resins. In addition, it can also be used for processing components such as display driver ICs.
The machine has a size of 900 × 760 × 1600mm, a weight of 520kg, and a maximum processing diameter of 100mm. The maximum output of the ultrasonic spindle is 400W.
The biggest feature of this machine tool is that it can be cut and ground at the same time. The principle is to apply ultrasonic vibration on the high speed rotating diamond blade. Moreover, due to the use of diamond blades, a variety of different materials can be processed, including hard materials such as glass and hard alloy, soft materials such as aluminum alloys and resins, and composite materials of metals, inorganic materials and resins. In addition, it can also be used for processing components such as display driver ICs.
The machine has a size of 900 × 760 × 1600mm, a weight of 520kg, and a maximum processing diameter of 100mm. The maximum output of the ultrasonic spindle is 400W.
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