[China Aluminum] The aluminum substrate has only been applied in some special fields earlier. In recent years, with the rapid development of LED lighting, it has emerged from the big PCB family. LED lighting products are mainly composed of three major structures: light sources, power supplies, and substrates. As one of them, the substrate accounts for a large part of the cost of the entire lamp.
The rapid development of LED lighting applications has brought endless vitality to aluminum substrates. The aluminum substrate industry has risen as if it were springing up, overnight, and everywhere. From the traditional large-scale PCB manufacturers, to home workshops, and some ceramic substrates, all went into battle to compete for LED lighting.
At the same time, the intensity of competition in the LED auxiliary materials market is no less than that of the downstream product applications. The price of aluminum substrates ranges from more than 100 yuan per square meter to more than 1,000 yuan. To win a bloody road in this "Red Sea", we must be clear about our position, and we must also have the core technology research and development capabilities.
New technological innovation
The technological innovation of aluminum substrates is more about packaging, and it aims at improving some issues that appear in the packaging process. Therefore, the new package form is also particularly concerned by aluminum substrate companies, especially COB packages.
COB packaging has attracted attention from all sides with low thermal resistance, high luminous efficiency, welding-free, and low-cost advantages as soon as it is available. It is also hailed by industry experts as one of the ten trends and hot spots of LED packaging technology in the future. However, COB packaging is not as good as everyone thinks, and it has not been quickly accepted by the market. At present, there are only a few applications on downlights. What has hindered its popularity?
The thermoelectric problem of high-power LEDs has been plagued by its application.
“In addition, the binding point of the COB package wire will be subject to vulcanization due to objective reasons, which in turn will cause the chip to yellow after being packaged and eventually affect the light decay. This is one of the cancers that affect the wide spread of COB.†Jian Yucang, general manager of Electronics Co., Ltd., said that this is also caused by the integration of the package for conductive purposes, with the existing packaging process is difficult to avoid.
In the LED lighting industry, heat conduction and heat dissipation is an important part of current lighting design, especially the heat dissipation of high-power LEDs, which has always been a bottleneck. If the heat conduction and heat dissipation problems are not solved during the design process, this product is very likely to be a waste product! Moreover, the problem of heat conduction has not been solved, and the radiator is no longer useful.
Most of the LED electrical energy is converted into heat energy, which drastically reduces the lifetime of the device. Because of the high thermal conductivity of aluminum, good heat dissipation, and can effectively export the internal heat, so the current use of high-power LED and LED lamps are basically the LED tube welded on the aluminum substrate, aluminum substrate and then through the thermal plastic and aluminum radiator Bonding.
The heat generated by the LEDs is conducted through the insulating layer to the metal substrate and then through the thermal interface material to the heat sink. This allows most of the heat generated by the LED to diffuse into the surrounding air by means of convection. However, the thermal resistance of the aluminum substrate and the thermal conductive adhesive is large, thus affecting the luminous efficiency and life of the LED.
Most common aluminum substrate insulating layers have little or no thermal conductivity, so that heat cannot be conducted from the LED to the heat sink (metal substrate) and the entire heat-dissipating channel cannot be unblocked. The heat accumulation of the LED will quickly lead to LED failure.
It can also be said that in the existing process flow, both ceramic and aluminum substrates cannot be avoided and new technologies are urgently needed to overcome them. So a kind of PCB-based thermoelectric separation technology is applied to aluminum substrates, and COB special aluminum substrates are available, which can not only solve the heat dissipation problem of the package, but also can perfectly overcome the COB vulcanization phenomenon and improve the light efficiency.
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